25 years of experience combined with state of the art equipment makes us your ideal partner for all your projects that require chip & wire bonding.
PCB, DBC or ceramic?
We can perform chip & wire bonding on PCB, DBC or ceramic substrates.
Gold or ALUMINIUM, Thin or thick wire?
Depending on your application, we can bond with either gold (Au) or aluminium (Al) wire.
Electrical requirements will determine if thin or thick wire bonding will be applied.
thin wire bonding – gold
- Gold wire
- 18-50µm wire diameter
- Ball ball bonding
- Stitch on ball
- Secure bonding
- Large surface (12″x6″)
- Deep access
Thin wire gold wire bonding movie (20s)
thin wire bonding – aluminium
- Aluminium wire
- 18-50µm wire diameter
- PiQC (Process Integrated Quality Control)
- E-box for controlled set-up
Aluminium thin wire bonding movie (40s)
thick wire bonding – aluminium
- Aluminium wire
- 125-500 µm wire diameter
- PiQC (Process Integrated Quality Control)
- All process data stored
Thick wire aluminium bonding (45s)
DIE & WIRE BOND PROTECTION
if required, we can protect the dies & bond wires with a glob top (epoxy or silicone) or a soft silicone gel.
It is equally possible to add an hermetic enclosure (ceramic or metal).