Electronics
Manufacturing
Services
Power
Module
Assembly
Advanced
manufacturing for
Power Modules
C-MAC specializes in Power Module Electronics Manufacturing Services, delivering high-performance solutions for demanding applications.
Our expertise in Wire Bonding, Die & Chip Bonding, and Direct Bonded Copper (DBC) assemblies ensures robust and reliable power module solutions. With state-of-the-art facilities in Europe and North America, we offer end-to-end support from prototyping to full-scale production, customized to your specifications.
Explore our
capabilities
Wire bonding is a critical process in power module manufacturing, establishing secure electrical connections between bare semiconductor dies and electrical circuits or module housing.
At C-MAC, we utilize advanced automated wire bonding technology to achieve precision and reliability, optimizing thermal and electrical performance. Our Die and Chip Bonding capabilities ensure every step is meticulously controlled for maximum efficiency, supporting both standard and custom configurations.
For high-power applications, DBC assemblies provide superior thermal management and mechanical stability. Our advanced manufacturing process ensures high-quality ceramic-based substrates with copper layers, improving electrical insulation and heat dissipation.
These assemblies are widely used in automotive, aerospace, and industrial power electronics, where efficiency and reliability are critical.
Beyond power circuit assembly, C-MAC offers fully integrated power module assembly, specializing in standard and hermetic modules. Our expertise in advanced manufacturing processes and custom module configurations ensures enhanced performance in high-voltage and high-temperature applications.
We provide optimal protection against environmental factors, making our solutions highly durable and dependable.
How we can support
your next project?
Whether you need a single prototype or full-scale production, C-MAC is ready to deliver high-performance power module manufacturing solutions.
Why Choose C-MAC for Power Module Electronics Manufacturing?
Choosing for C-MAC is choosing for
- 50+ years of experience in high-performance manufacturing
- A trusted partner for Power Module assembly
- Superior thermal management thanks to our cutting-edge bonding capabilities
- Seamless integration ensured by our Vacuum reflow soldering for Surface Mount Technology (SMT)
- Seamless integration ensured by our Selective soldering equipment for Through-Hole-Technology (THT)
- Operating with precision automation we ensure the highest quality and consistency
Flexible
Manufacturing
Support for both standard and hermetic module assembly tailored to your exact needs.
Lean
Manufacturing
Utilizing VMI, KANBAN, and JIT principles for competitive pricing and on-time delivery.
Scalability
From prototyping to large-scale production, we provide the capacity and expertise to meet your needs.
