To ensure performance, quality and reliability of your power electronics applications, advanced materials and assembly techniques are required.
DBCA is an excellent choice for high power, high temperature applications.
A DBC substrate consists of a ceramic isolator to which a thick copper layer (200 -600 µm) is applied on both sides.
Advantages:
- High heat conductivity
- High temperature resistance
- High isolation voltage
- High heat spreading.
- Matching expansion coefficient allows chip on board assembly
- Easy processing (master cards)
LET US help you to Select the right material for your project
- Alumina (Al2O3): good thermal conductivity (24W/mK)
- Aluminium nitride (AlN): more expensive but superior thermal performance (>170W/mK)
- HPS or silicon based substrates: for ultra demanding applications
DBC Soldering
We offer magazine to magazine pick & place with vacuum soldering & 100% inspection, for minimal handling and maximum reliability.
DBC wire bonding (magazine to magazine)
Depending on your requirements we can perform:
- Thin gold wire bonding: 18-50µm
- Thin aluminium wire bonding: 18-50µm
- Thick aluminium wire bonding: 125-500µm
Thick aluminium wire bonding movie (45s)
FULLY AUTOMATIC DBC SINGULATION
Custom automated singulation equipment combines risk-free handling with fast throughput.
- Unit traceability
- Automatic bad marked part sorting
- Camera inspection
Fully automated singulation movie (1m05s)
DBC AUTOMATED BOND WIRE INSPECTION & TEST
- Up to 280 parameters/unit are verified
- Database coupled
- Fast throughput
- Camera inspection
- Labelling
- Tray stuffing