Direct copper bonding assembly

To ensure performance, quality and reliability of your power electronics applications, advanced materials and assembly techniques are required.

DBCA is an excellent choice for high power, high temperature applications.

A DBC substrate consists of a ceramic isolator to which  a  thick copper layer (200 -600 µm) is applied on both sides.

Advantages:

  • High heat conductivity
  • High temperature resistance
  • High isolation voltage
  • High heat spreading.
  • Matching expansion coefficient allows chip on board assembly
  • Easy processing (master cards)

LET US help you to Select the right material for your project

  • Alumina (Al2O3): good thermal conductivity (24W/mK)
  • Aluminium nitride (AlN): more expensive but superior thermal performance (>170W/mK)
  • HPS or silicon based substrates: for ultra demanding applications

DBC Soldering

We offer magazine to magazine pick & place with vacuum soldering & 100% inspection, for minimal handling and maximum reliability.

DBC wire bonding (magazine to magazine)

Depending on your requirements we can perform:

  • Thin gold wire bonding: 18-50µm
  • Thin aluminium wire bonding: 18-50µm
  • Thick aluminium wire bonding: 125-500µm

Thick aluminium wire bonding movie (45s)

FULLY AUTOMATIC DBC SINGULATION

Custom automated singulation equipment combines risk-free handling with fast throughput.

  • Unit traceability
  • Automatic bad marked part sorting
  • Camera inspection

Fully automated singulation movie (1m05s)

DBC AUTOMATED BOND WIRE INSPECTION & TEST

  • Up to 280 parameters/unit are verified
  • Database coupled
  • Fast throughput
  • Camera inspection
  • Labelling
  • Tray stuffing