For more than 10 years, C-MAC is building custom power parts and modules. Providing a dedicated solution, guaranteeing the best performances in the smallest possible packaging, is a key element in all our solutions.

Power modules can be based on DBC (Direct Bonded Copper substrates), AMB (Active Metal Brazed substrates) IMS (Insulated Metal Substrates), Standard & Power PCB or Thick film. Thick film substrates are produced inhouse, other carriers are sourced from qualified sources on the market. We use as well discrete components as ‘chip & wire bonding’ technology. C-MAC has 2 fully automated lines for vacuum soldering for single sided ceramic boards (DBC, AMB, thick film) All alu thick wire options are available, going from 125µm to 500µm. C-MAC can supply semi-finished products (assembled boards without housing, which are shipped in dedicated trays to the customer) as well as complete finished and tested modules. Applications are based on mosfets with classic Si (silicium), GaN (Gallium Nitride) or SiC (Silicon Carbide) technology, depending on customer needs. More recently we also invested in new Selective Soldering lines to support new designs for power converters used for various e-mobility applications.

Extensive
Experience

Leading Process
Capabilities