25 years of experience combined with state-of-the-art equipment makes us your ideal partner for all your projects that require chip & wire bonding.

We can perform chip & wire bonding on PCB, DBC or ceramic substrates but also interconnect your electronics board with your module housing if required. It is equally possible to add an hermetic enclosure (ceramic or metal). Depending on your application, we can bond with either gold (Au) or aluminium (Al) wire. Electrical requirements will determine if thin or thick wire bonding will be applied. If required, we can protect the dies & bond wires with a glob top (epoxy or silicone) or a soft silicone gel. We can perform all these processes under our automotive, Aerospace & Medical market certifications

25 years of
experience

Leading Process
Capabilities