Electronics
Solutions
Manufacturer
Led
Assembly
Providing High
Quality LED
Assemblies:
C-MAC has extensive experience with ceramic & pcb based solutions for LED lighting. When space is limited and heat needs to be removed, ceramic solutions come to the rescue.
The ceramic base will provide excellent heat dissipation and a uniform heat transfer whilst providing excellent matching of the LED die & substrate thermal coefficient. The reflectivity and electrical isolation of the base material are also excellent to deliver a final solution that is very cost competitive to special PCB solutions. We also handle a broad spectrum of other LED applications, from simple metallised substrates to complex water-cooled modules integrating hundreds of bare die LEDs.
Superior
Quality
Process, Testing, Inspection and Traceability according to IPC and major market standards
Leading Process
Capabilities
Ceramic circuit printing , State of the art SMT, Coating, various type of boards; chip on board
Design for
Manufacturing
Our engineering and process teams have extended experience to optimise your design for manufacturing
Our solution engineers are here to help
Navigating challenges, delivering solutions
Frequently
Asked
Questions
smt, leaded, bare die
Please contact our engineering team, this depends on the type of led & substrate
From Ceramic Substrates & PCB over metallised substrates to complex water-cooled modules
We have to capability to integrate hundreds of bare die LEDs.
We can provide 2D & 3D AOI, X-ray, Flying probe, ICT & functional testing.
Automotive; IATF16949; Medical: ISO-13485; Aerospace: EN 9100
We can accommodate gold, aluminium etc wire bonding, see specific section for detailed capabilities.
We can provide Automated & Non-Automated T&R, Custom Trays etc