Electronics
Solutions
Manufacturer
Custom
New Process
Solutions
Process Development
for new & existing
technologies:
If your electronics design requires new or modified process technologies, our C-MAC engineering team has a proven track record of implementing and combining various new & existing process technologies.
We support you to optimise your design for a reliable quality process with our existing broad technology range and willingness to include new processes. C-MAC is your ideal one-stop solution provider for next generation electronics solution designs. You can rely on our ‘Design for Cost’ ‘Design for Manufacture’ and ‘Design for Test’ services for the highest quality solutions at the lowest cost. All this in plants certified for Automotive, Aerospace & Medical markets. We have longterm and outstanding experience in power & control modules, sensors and monitoring electronics.
Superior
Quality
Process, Testing, Inspection, and Traceability according to IPC and major market standards
Leading Process
Capabilities and Innovation
Thick Film printing, Selective Soldering, SMT, Die & Wire Bonding, Vacuum Soldering, Module Assembly, Hermetic Sealing, Coating and Encapsulation
Design for
Manufacturing
Our engineering and process team have extended experience to optimise your design for manufacturing
Our solution engineers are here to help
Navigating challenges, delivering solutions
Frequently
Asked
Questions
You can find these in our Solutions overview but we are not limited to these
We look a Sintering, next gen circuit printing, power module integration, ribbon bonding ..
Depending on equipment lead-times + initial testing this can take from 1 to 3 years time
We can provide 2D & 3D AOI, X-ray, Flying probe, ICT & functional testing
Automotive; IATF16949; Medical: ISO-13485; Aerospace: EN 9100
We can accommodate gold, aluminium etc wire bonding, see specific section for detailed capabilities.
We can provide Automated & Non-Automated T&R, Custom Trays etc
Markets
News
