Electronics
Solutions
Manufacturer
Module
Assembly
Turnkey
Solutions for
Module Assembly :
C-MAC offers turnkey solutions for your module assembly requirements. Depending on the nature of the project, we can perform Glueing, Protective gel dispensing (under vacuum), Mechanical assembly, Interconnection (wire bonding), (laser) marking for traceability purposes & extensive Testing and measurements.
We also provide possibilities for hermetic modules & power modules : see our detailed sections regarding these. If volume requirements make automation an efficient option, we have the engineering and process skills to develop custom production lines together with our automation partners.
Turnkey
Solutions
If you cannot find an existing process that matches your production needs, we provide you solutions
Leading Process
Capabilities
Wire & Die Bonding , Selective Soldering, State of the art SMT, Coating, vacuum soldering , hermetic sealing
Supply Chain
Management
Extensive supplier relations, Competitive & Reliable, Experience with VMI, KANBAN, JIT and flexible to adapt to specific customer needs
Our solution engineers are here to help
Navigating challenges, delivering solutions
Frequently
Asked
Questions
Yes, we have selective conformal coating available but also Globtop sealing
We can provide 2D & 3D AOI, X-ray, Flying probe, ICT & functional testing
Automotive; IATF16949; Medical: ISO-13485; Aerospace: EN 9100
We can accommodate gold, aluminium etc wire bonding, see specific section for detailed capabilities.
We can provide Automated & Non-Automated T&R, Custom Trays etc
Markets
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