C-MAC MicroTechnology has a leading-edge facility for manufacturing high reliability modular electronics using the green tape technology known as low-temperature co-fired ceramic or LTCC.
LTCC is an alternative glass-ceramic multilayer substrate medium that incorporates conventional thick-film-material metal systems, providing a rugged, cost competitive substrate that can incorporate embedded passive components, along with more advanced devices such as flipchips and wire bonded bare die. Cavities can be configured in an LTCC substrate to provide controlled-impedance wire bond connections and high-reliability packaging solutions.
LTCC technology is extremely useful in a diverse range of applications, including high-volume automotive systems. It is becoming the technology of choice for high-frequency RF and microwave applications in the wireless and radar industries.
Passive components can be buried between the LTCC tape layers, minimizing the length of interconnects, improving integration and robustness, and further reducing circuit geometry. This capability is supported by continual substantial investment in fully automated production facilities to maintain the consistent levels of quality demanded by our customer's high reliability requirements.
Substrates manufactured using the cofired technique can be processed using the same methods as standard alumina substrates. Once they have been fired, laser trimmed and singulated they can be populated using standard surface mount and advanced chip-and-wire techniques.
Related links:
PCB
Thick-film hybrids
Photodefined
BeO
Other substrates
Manufacturing overview
