Technologies suited to medical electronics applications
With over 30 years’ experience delivering high-reliability electronic modules and systems on a global basis, our engineering teams have developed a wide range of capabilities including:
- Thick-film hybrid and LTCC (low-temperature co-fired ceramic) substrates
- Hermetically sealed chip-and-wire assemblies
- Gold and aluminium wire bonding
- PCB assembly
- Full system assembly
Our expertise in rugged hybrid microelectronics is particularly relevant to applications such as surgical power tools, where reliable operation after 1000 autoclave sterilization cycles in steam at 135°C is required.
Our proposition to medical electronics OEMs is enhanced by our ISO 13485 accredited manufacturing facilities, as well as by an internationally recognized and accredited test house providing broad ranging environmental stress screening and qualification services. We also have a comprehensive electrical test capability to verify the products we supply.
Microelectronic product design and development
Our specialized engineering teams provide focused support for our customers. Areas of expertise include:
- Electronics circuit design and simulation
- Package design and evaluation
- Circuit layout appropriate for chosen
technologies
- Prototype build, test and evaluation
- Test solution development
- Test hardware and software development
- SPC (statistical process control) process
analysis
- FMEA (failure mode and effects analysis) process analysis
- Transition of product into volume
manufacture
- Full product qualification
Assembly and test
We have a wide range of manufacturing capabilities. We can build product from receipt of a silicon wafer through to assembly and test of a module or PCB, and finally integrate these units into a full rack or system solution.
- Silicon wafer probe and saw
- Automatic pick-and-place of bare die
- Automatic wire bond and glob top
- Electrical test and data analysis
- High-speed SMT pick-and-place
- Automatic optical inspection
- X-ray inspection, including real-time x-ray analysis
- Thermal imaging
- High-speed flying probe test
- Functional and in-circuit test
- Over temperature test
- Environmental test – shock, bump, vibration
- Accelerated life test/burn-in
- Final certificate of conformance release
Quality accreditation and certification
ISO 13485, ISO 9001:2000 and ISO 17025 independent test house accreditation.
Related links:
Automotive sector
Space
High-reliablity Industrial applications
Energy sector
Aerospace & defence
